CEM-3 Copper Clad Laminate for PCB Manufacturing | CEM-3 CCL Manufacturer
CEM-3 Copper Clad Laminate (CEM-3 CCL) is a reliable PCB substrate for single-sided and double-sided printed circuit boards. It offers good electrical insulation, mechanical strength, dimensional stability and strong copper foil adhesion. Suitable for LED lighting, power supply, consumer electronics, communication equipment and industrial PCB applications. Custom specifications are available for bulk orders.
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Description
CEM-3 Copper Clad Laminate for PCB Manufacturing
CEM-3 Copper Clad Laminate (CEM-3 CCL) is a composite epoxy material designed for printed circuit board manufacturing. It combines a non-woven fiberglass mat core with fiberglass reinforcement and epoxy resin, providing a balanced combination of electrical insulation, mechanical strength, dimensional stability, and processing performance.
Our CEM-3 copper clad laminate is suitable for a wide range of PCB applications, including LED lighting boards, power supply boards, consumer electronics, communication equipment, industrial control boards, and other electronic products.
We support different laminate thicknesses, copper foil thicknesses, panel sizes, and other specifications according to customer requirements.
Key Features
Excellent Electrical Insulation
CEM-3 copper clad laminate provides reliable electrical insulation for PCB manufacturing and electronic applications, helping maintain stable circuit performance.
Good Mechanical Strength
The composite structure provides good mechanical strength and durability during PCB fabrication processes such as drilling, routing, cutting, and assembly.
Good Dimensional Stability
CEM-3 CCL maintains stable dimensions during PCB processing, helping improve manufacturing consistency and finished PCB quality.
Reliable Thermal Performance
The material provides reliable thermal performance for a variety of electronic and PCB applications under appropriate operating conditions.
Strong Copper Foil Adhesion
The copper foil is firmly bonded to the laminate substrate, supporting reliable circuit formation and PCB fabrication.
Customizable Specifications
Different laminate thicknesses, copper foil thicknesses, panel dimensions, and other specifications can be provided according to customer requirements.
CEM-3 Copper Clad Laminate Structure
CEM-3 CCL is a composite laminate material consisting primarily of:
- Copper foil
- Fiberglass reinforcement
- Non-woven fiberglass mat
- Epoxy resin system
This composite structure provides a balance between electrical, mechanical, thermal, and processing properties required for PCB manufacturing.
Applications of CEM-3 Copper Clad Laminate
CEM-3 copper clad laminate is widely used as a PCB substrate for various electronic applications.
LED Lighting
Suitable for PCB applications used in LED lighting products, LED drivers, and related electronic systems.
Power Supply
Used for applicable power supply boards and electronic power management products.
Consumer Electronics
Suitable for various consumer electronic products requiring reliable PCB substrate materials.
Communication Equipment
Can be used in applicable communication and electronic control equipment.
Industrial Electronics
Suitable for industrial control boards, electronic control systems, and other industrial electronic applications.
Automotive Electronics
Can be used for suitable automotive electronic PCB applications according to design and material requirements.
Why Choose Our CEM-3 Copper Clad Laminate?
Consistent Product Quality
We focus on stable material quality and consistent manufacturing performance for PCB production requirements.
Flexible Specifications
We can support different board thicknesses, copper foil thicknesses, panel sizes, and other product requirements.
Bulk Supply
Our CEM-3 CCL products are suitable for PCB manufacturers, electronic product manufacturers, distributors, and other B2B customers.
Customized Solutions
Customers can provide their required PCB material specifications, dimensions, copper foil requirements, and order quantities for evaluation.
Factory Supply
We provide CEM-3 copper clad laminate for customers requiring regular production supply and bulk purchasing.
Quality Control
Quality control is an important part of CEM-3 copper clad laminate production.
Depending on the product specification and customer requirements, quality control may cover:
- Laminate thickness
- Copper foil thickness
- Surface condition
- Dimensional consistency
- Copper foil adhesion
- Electrical properties
- Mechanical properties
- Thermal performance
- Appearance inspection
- Packaging inspection
Product specifications and inspection requirements can be confirmed before mass production.
Packaging and Delivery
CEM-3 copper clad laminate sheets are carefully protected during storage, handling, and transportation.
The packaging can be arranged according to product dimensions, order quantity, transportation method, and customer requirements.
For bulk orders, we can discuss suitable packaging and shipping arrangements according to the destination and delivery requirements.
Request a Quote
Looking for a reliable CEM-3 copper clad laminate supplier for your PCB manufacturing requirements?
Send us your required:
- Laminate thickness
- Copper foil thickness
- Panel size
- Order quantity
- Application
- Delivery destination
Our team will provide product information and a quotation based on your requirements.
Request a Quote for CEM-3 Copper Clad Laminate
Specifications
| Item | Specification / Typical Value |
| Product | CEM-3 Copper Clad Laminate |
| Base Material | Composite Epoxy Material |
| Reinforcement | Non-Woven Glass Fabric |
| Resin System | Epoxy Resin |
| Copper Foil | Electrolytic Copper Foil |
| Copper Side | Single Side / Double Side |
| Board Thickness | 0.40–3.20 mm |
| Copper Thickness | 18 / 25 / 35 / 50 / 70 / 105 μm |
| Standard Size | 1020 × 1220 mm / 1030 × 1230 mm |
| Color | Natural / Green / Yellow |
| Flammability | UL94 V-0 |
| Tg | Approximately 110–130°C |
| Dielectric Constant @ 1 MHz | Approximately 4.2–4.8 |
| Dissipation Factor @ 1 MHz | ≤ 0.025 |
| Volume Resistivity | ≥ 1 × 10¹³ Ω·cm |
| Surface Resistivity | ≥ 1 × 10¹² Ω |
| Peel Strength | ≥ 1.2 N/mm |
| Flexural Strength | ≥ 350 MPa |
| Water Absorption | ≤ 0.8% |
| Solder Resistance | ≥ 10 sec @ 260°C |
| CTI | ≥ 175 V / 250 V / 600 V* |
| Thermal Stress | ≥ 10 sec @ 260°C |
| Z-Axis CTE | Approximately 50–70 ppm/°C |
| Thermal Conductivity | Approximately 0.3–0.4 W/m·K |
| Warpage & Twist | ≤ 1.0% |
| Surface | Smooth, Clean, Free from Scratches |
| Application | Consumer Electronics, LED Lighting, Home Appliances, Power Supplies, Industrial Electronics, Automotive Electronics |
FAQ
What is CEM-3 copper clad laminate?
CEM-3 copper clad laminate is a composite epoxy material used as a substrate for printed circuit board manufacturing. It combines fiberglass reinforcement, non-woven fiberglass mat, and epoxy resin with copper foil.
What is CEM-3 CCL used for?
CEM-3 CCL can be used for applicable PCB applications in LED lighting, power supplies, consumer electronics, communication equipment, industrial electronics, and other electronic products.
Can CEM-3 copper clad laminate be customized?
Yes. Depending on production capabilities and requirements, specifications such as laminate thickness, copper foil thickness, panel size, and order quantity can be discussed and customized.
What information is required for a quotation?
For an accurate quotation, customers can provide the required laminate thickness, copper foil thickness, panel size, quantity, delivery destination, and any special technical requirements.
Do you support bulk orders?
Yes. CEM-3 copper clad laminate is suitable for B2B bulk purchasing. Customers can contact us with their required specifications and estimated order quantity.
Can you provide technical data sheets?
Yes. Technical specifications and product documentation can be provided according to the applicable product grade and customer requirements.
Lead Time Estimator
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